i7 is kinda hard cuz there is a layer of solder between the IHS and the die it self, you have to heat that sucker up to the milting temp of the solder they used, i have never tried it on the newer i7s and also if i remember correctly i think when you take that off you'll run into prob like when you are docking the pot on it you may crack the die, or the die is too low and the bracket is too tall and you have to take the bracket off which it's not a huge deal cuz all 1155, 1156, 1366 and 2011 so far have removable brackets, but just not the best idea if you do something to the chip while it's running it may jack up your board... then it's 2 weeks of no bench time yeah i been there IT SUCKED!
but when i did my old chip i kinda just took a really sharp knife i got from my mom's lab (the knife they cut body tissues with) and kinda just cut the seal around the cpu and just leave the knife in there (each side) and leave it in the oven having the IHS facing down on like a pan of some kind and once it's at the milting temp it'll just pop off
some people use those crack razer blades those are super cheap and easy to get
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