[FACE]

The trick in both Lga and PGA sockets is to make the cpu area air tight. I do not put grease in or around the socket. Sealing the area around the cpu with eraser works fine by itself. you can insulate up the side of the socket and cpu to the very top edge of teh ihs and not interfere with the cooler (wb/ evap/pot) at all.

so I would try the eraser method until you get the dragon skin method perfected. Make it thin on the mobo, and gradually mound it up around teh socket until you have it up level with the cpu. Make sure it is pressed tight to the sides of the socket and cpu and your worries are over.

[ny_driver]

Thanks FACE, I'm going to get the kneaded eraser and use that in addition to the dragon skin right around the socket and give it another go.

I'm up and running again with the 965BE now.

I stuck my bad memory module in the freezer for like 2-3 days and it works again too.

I'm ready to party dudes!

[rickss69]

A little eraser around the perimeter of the cpu is all you need...not even neccessary to seal it to the Dragon Skin.





"Sorry for my ignorance Rick, but what do you mean constant pressure? And do you mean put eraser all around the surface of the chip and the socket? Once I got the chip seated I put more Dragon Skin around the edges of the chip and socket to seal it up better, but it doesn't really stick to the edge of the IHS "

What I meant ny was I think the Thuban will degrade quickly after some spectacular benching blasts...maybe not die but never perform as well as it did initially.

[rickss69]

Just read back thru the thread and in post #93 is where you had the massive water leak. I would be very careful about using Dragon Skin like you are around the cpu socket...you think the grease was hard to remove.

Everywhere else the Dragon Skin is fine except in the dimm/pci sockets of course. You want it to flow under and around everything, just as water would do.

[ny_driver]

Thanks for the picture....it lets me know it doesn't have to be prettyEDIT: THanks for the explanation too...I didn't see it down there at first.

I'm gonna overclock the piss out of this 965BE. I got it IBT/max stress stable @ 4GHz/1.428v and not chilling the chiller...max core temp of 39c. It's the 194th chip off the wafer so it should be pretty good I hear. My 1055T is the 247th chip.

By tonight I'll be chilling it and also have my 2x4890s back on water and my new loop with cool blue washer fluid, which is going to look pretty sweet.

Stop back later for pictures.

[rickss69]

Have you skinned the cards as well?

[ny_driver]

You aren't saying let it flow under the edges of the cpu socket are you? But you do let it run under the DIMMS and PCI-E slots? I'd rather it didn't...I have my board tilted so water can only run off the back and not towards the pci-e slots.

Are you sure it's ok to let it run under the DIMMS?

Sorry to ask so many questions, but I really don't want to fuck this up again. ASUS won't do another advanced replacement.

EDIT: not chilling the cards.

[rickss69]

Originally Posted by ny_driver

You aren't saying let it flow under the edges of the cpu socket are you? But you do let it run under the DIMMS and PCI-E slots? I'd rather it didn't...I have my board tilted so water can only run off the back and not towards the pci-e slots.

Are you sure it's ok to let it run under the DIMMS?

Sorry to ask so many questions, but I really don't want to fuck this up again. ASUS won't do another advanced replacement.

EDIT: not chilling the cards.

Yes, let it flow under anything it is able to...that will prevent any moisture from gaining access to those areas. Just don't get it inside the sockets as that would prevent good contact. Dragon Skin will not harm anything as it is non-conductive.

[ny_driver]

EVEN the cpu socket? It's not going to prevent anything from making contact? I need to google some pictures of the inside of a AM3 socket for my own peace of mind.