Before we get to the clocking, here are just a couple photos of the package and the modules in question.
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As we can see, the package for memory has evolved a bit with the triple channel packs. Manufacturers can no longer just stuff three of these sticks in a molded plastic shell with a cardboard insert and call it a day. OCZ has gone with two modules in one shell and a single module in another shell, then both jammed into a box. The box is of decent quality and does add another small layer of protection during transport.
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The heat sinks that identify the modules as part of the Blade series are quite nice, and normally I don't find much of anything that simply serves an aesthetic purpose nice. Obviously the heat sinks do help dissipate heat but let's be honest...do they really need to be there? Have heat sinks ever really needed to be there? And no, I am not asking those questions, so don't answer and turn this thread into an "internet engineers" thermal dynamics discussion that holds as much water as a plastic jug that Brian uses to pour LN2 with. If you don't get the joke, it is because you are not cool enough to...deal with it.
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These are mostly just glamour shots showing off the fact that I have a macro lens, but they do a good job showing the heat sink construction and thermal pads OCZ uses. And before you ask, no, I am not potentially killing these bloody sticks to take the heat sinks off to show you they are Elpida Hyper. You want to see the IC's? Look at the press release photo from Elpida in the specifications section. To be honest, the heat sinks look like they would come off quite easily but still, I don't want to give you the satisfaction.